PhD Candidate in Quantum Chip Packaging (On-site)

Job summary

This PhD project focuses on the design and fabrication of self-alignment structures for quantum chip packaging, utilizing advanced 3D printing techniques. The candidate will engage in both theoretical and experimental aspects, contributing to innovative solutions for photonic integrated circuit (PIC) packaging.

Qualifications

• A two-year master's degree (120 ECTS points) or equivalent academic level.
• Strong background in mechanical engineering and 3D design.
• Documented hands-on experience with high-resolution 3D printing.
• Basic understanding of photonic chip packaging is required.
• Experience in solid mechanics, materials science, and Multiphysics modelling is advantageous.
• Prior publications and conference participations will be positively regarded.

Responsibilities

• Design lightweight and mechanically stable self-alignment structures for PIC packaging.
• Fabricate structures using two-photon polymerization micro 3D printing.
• Characterize the topology and mechanical properties of the fabricated structures.
• Test the performance of the structures for PIC packaging.
• Analyze experimental data and contribute to scientific publications.
• Involve in teaching and supervising BSc and MSc courses and student projects.

Skills

• Proficiency in 3D design and microfabrication techniques.
• Strong analytical and problem-solving skills.
• Ability to collaborate effectively in an international research environment.

Education

• A master's degree in a relevant field is required.

Tools

• Experience with two-photon polymerization micro 3D printing and characterization tools is beneficial.