Electronics Packaging Engineer

Job summary

This role focuses on addressing packaging and integration challenges in advanced medical micro-electronics, specifically in the development of hearing solutions. The position involves designing and integrating modules at the interface between integrated circuits (ICs) and printed circuit boards (PCBs).

Qualifications

• B.Sc. or M.Sc. in Electronics Engineering, Microelectronics, Materials Engineering, or a related technical field.
• Mid-level experience preferred, but early-career candidates with a strong technical foundation are welcome.

Responsibilities

• Tackle packaging and integration challenges in advanced micro-electronics.
• Review and enhance interfaces between mechanical constraints, System-in-Package modules, and PCB/Flex substrates.
• Collaborate with suppliers on manufacturability and technical alignment.
• Participate in design reviews, technical problem-solving, and documentation.
• Work closely with teams across hardware, testing, quality, and production.
• Support development from concept through to production readiness and market support.
• Contribute to PCB-related integration and design activities based on background.

Skills

• Experience in electronics packaging, hardware integration, or related hardware development.
• Knowledge of PCB design/layout and interest in packaging and hardware integration.
• Understanding of PCB technologies and manufacturability constraints.
• Ability to collaborate across technical disciplines and with external suppliers.
• Structured approach to documentation and quality assurance.
• Innovative mindset with a desire to improve technical solutions.

Education

• B.Sc. or M.Sc. in relevant engineering fields.

Tools

• Familiarity with PCB layout, flex or flex-rigid technologies, and high-density electronics is a plus.