Postdoctoral Researcher in Microchip Cooling Solutions

Job summary

This position is for a full-time Postdoctoral Researcher focused on next-generation microchip cooling solutions, specifically utilizing two-phase heat transfer technologies. The role involves collaboration with a diverse team in the Section of Manufacturing Engineering, aiming to enhance thermal management for AI chips with high energy densities.

Qualifications

• PhD degree in mechanical engineering, physics, or related fields.
• Experience in numerical simulations using COMSOL or OpenFOAM.
• Cleanroom fabrication skills, particularly in UV lithography, plasma etching, and wafer bonding.
• Familiarity with experimental characterization of heat transfer processes.
• Strong communication skills in English and the ability to work independently in a dynamic research environment.

Responsibilities

• Develop numerical models to analyze two-phase heat transfer processes.
• Design geometries for cooling devices.
• Fabricate and package microchannel heat sinks in a cleanroom setting.
• Optimize experimental setups to evaluate cooling performance.
• Integrate solutions for testing in industry-relevant environments.
• Publish research findings in high-quality journals and present at conferences.
• Engage in teaching activities, including supervising PhD and MSc student projects.

Tools

The position is based on-site and offers a two-year employment period.

• Numerical simulation software (COMSOL, OpenFOAM).
• Cleanroom fabrication equipment.