Packaging and Fabrication Engineer

Job summary

The Q-PLANET project is an EU-funded initiative focused on establishing a European pilot line for quantum applications and developing advanced quantum devices. The project involves collaboration among approximately 30 partners from academia and industry, with a significant role played by DTU Nanolab, which specializes in Photonic Integrated Circuits (PIC) fabrication and packaging. The team is looking to hire up to four engineers, with three focusing on packaging and one on device fabrication.

Qualifications

• Master’s degree or PhD in engineering, physics, or a related technical field.

Responsibilities

• For the device fabrication engineer: Develop and standardize optical elements fabrication, primarily in clean room facilities.
• For packaging engineers: Establish the Assembly Design Kit (ADK) for optical and electrical elements, focusing on optical fiber integration into PIC, chip bonding, and optical characterization.

Skills

• Clean room engineer: Basic fabrication skills including dry etching, thin film deposition, and lithography; characterization skills such as ellipsometry, SEM, AFM, and PL.
• Packaging engineer: Advanced dicing techniques, chip bonding (wire and flip chip), fiber array packaging, and optical/electrical characterization.
• Strong communication and coordination skills, ability to work independently, and systematic reporting of process development results.
• Fluency in English.

Education

• Master’s degree or PhD in engineering, physics, or a similar technical field.

Tools

• Semiconductor fabrication equipment, clean room tools, optical and electrical characterization instruments.